| abstract |
The present invention,n n n (A) Structural unit (T-2 unit) containing 30-100 mol% of structural units (T unit) represented by following formula (1), and containing one silanol group represented by following formula (2) among these T units. ) A silanol group-containing silicone resin containing 30 to 80 mol% and having a number average molecular weight of 100 or more;n n n n n R 1 -SiZ 3 n n n n n n n R 1 -Si (OH) Z ' 2 n n n n n (Wherein R 1 represents a substituted or unsubstituted monovalent hydrocarbon group, Z is selected from an OH group, a hydrolyzable group and a siloxane residue, at least one of three Z represents a siloxane residue and Z ′ is a siloxane Residues)n n n (B) It relates to the composition for silicone containing film formation containing the polymer which polymerizes the monomer containing an acrylic acid ester, methacrylic acid ester, or a mixture thereof.n n n By using the composition of the present invention, it is porous, low dielectric constant, flat, uniform, small in dielectric constant, and high in mechanical strength, so that an optimum film can be formed as an interlayer insulating film when used in the manufacture of semiconductor devices. |