http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20020052739-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a492183be65153abfa7dec00d51c816
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-482
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28
filingDate 2000-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11cc1da8a73664e2470216ebf556fb3a
publicationDate 2002-07-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20020052739-A
titleOfInvention Method for fabricating fine conducting lines of semiconductor memory device
abstract The present invention provides a method for forming a fine wiring of a semiconductor memory device, comprising: forming a thermal oxide film on a silicon substrate; Forming a nitride film on the thermal oxide film; Patterning the nitride film in a predetermined pattern such that a predetermined portion of the substrate is exposed; Forming a CVD oxide film spacer on a side surface of the nitride film pattern; Implanting ion into the exposed substrate to form a buried bit line; And removing the oxide film and the nitride film.
priorityDate 2000-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
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http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5461123
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419579069
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559572

Total number of triples: 17.