Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b11ea5dc84c60e79c57d928508b691ec http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b44c910a4185b2310c11fe97c209627e |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K2101-36 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-02 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
filingDate |
2001-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_29d6cb4653a98061a6efca210d249003 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bae4d3ca08690ac3ea4b3ae8a67469b0 |
publicationDate |
2002-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20020046192-A |
titleOfInvention |
Solder, method for processing surface of printed wiring board, and method for mounting electronic part |
abstract |
The solder essentially contains 1.0 to 4.0 mass% Ag, 0.2 to 1.3 mass% Cu and 0.02 to 0.06 mass% Co, and the balance contains Sn and unavoidable impurities. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100887357-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100887358-B1 |
priorityDate |
2000-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |