http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20020043604-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1089 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G11B5-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate | 2000-09-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2002-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20020043604-A |
| titleOfInvention | Seed layers for interconnects and method and apparatus for their fabrication |
| abstract | One embodiment of the present invention includes the steps of (a) forming a patterned insulating layer on a substrate comprising at least one opening and a field surrounding the at least one opening; (b) depositing a barrier layer on the interior surface of the field and the at least one opening; (c) depositing a first seed layer on the barrier layer using a first deposition technique; (d) depositing a second seed layer on the first seed layer using a second deposition technique different from the first deposition technique; And (e) electroplating a metal layer on the second seed layer, wherein the electroplated metal layer comprises a material selected from the group consisting of Cu, Ag or an alloy comprising at least one of such metals. A method of forming a metal interconnector is featured. |
| priorityDate | 1999-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 25.