http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20020043020-A

Outgoing Links

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76828
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31
filingDate 2000-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da5087578035fa4c89d81985f6ae33b2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c5b22538e002f0c1a3b9adc7f402746c
publicationDate 2002-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20020043020-A
titleOfInvention Insulator layer of semiconductor device and method for forming the same
abstract Provided are an interlayer insulating film of a semiconductor device having excellent low dielectric constant characteristics and a method of forming the interlayer insulating film. The interlayer insulating film is formed between the metal wirings, a porous silica film having excellent low dielectric constant characteristics is formed, and a SiOxCyHz film having a dielectric constant of 2.7 is deposited as a hard mask film and a lower mask film, respectively, on and under it.
priorityDate 2000-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 19.