| abstract |
A metal layer is formed on each surface of the upper substrate electrodes on the substrate. Another metal layer is formed on each surface of the chip electrodes of the functional device chip. Both ends of the vertical coil springs are connected to the upper substrate electrodes and the chip electrodes, respectively, through the metal layers. In this way, the upper substrate electrodes are connected to the chip electrodes by flip chip bonding through the vertical coil springs. Thus, a semiconductor device having a flip chip bonding structure, a manufacturing method thereof, and a coil spring cutting jig and a coil spring guide jig used therein are provided, thereby preventing connection failure due to thermal expansion difference between the functional device device and the substrate. It is possible to easily reconnect functional device devices and boards after separation from each other because the functional device devices and the boards connected through connection formation have been found to be defective in the electrical inspection after the test connection. Even if this simple, low packaging cost and high power consumption functional device device is used, it is possible to realize low thermal resistance and high connection reliability. |