Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P20-54 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2201-0464 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-26 |
filingDate |
2001-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e9430173234e223697c182e7b1037b3a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b3918f99d03e500a974b0e7ee3a1987 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8759944600c45d234a39b62d4ff3a6e8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7801423940cabae20bd01d28b9d371c |
publicationDate |
2002-05-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20020037286-A |
titleOfInvention |
Process for producing porous polyimide and porous polyimide |
abstract |
The present invention relates to a low dielectric constant heat resistant porous polyimide of a fine cell structure. The porous polyimide is added by adding a dispersible compound to the polyimide precursor to form a micro-domain structure such that the dispersible compound is dispersed in the polymer and has a size smaller than 10 μm, followed by extraction with supercritical carbon dioxide. Prepared by a process comprising removing the acidic compound to make the precursor porous, wherein the interaction parameter χ AB between the polyimide precursor (A) and the dispersible compound (B) is greater than three. Such porous polyimide has an average bubble diameter of less than 5 mu m and a dielectric constant of 3 or less. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9725565-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10112368-B2 |
priorityDate |
2000-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |