| abstract |
The semiconductor device includes a semiconductor chip and a wiring board. The metal electrode of the semiconductor chip and the internal connection terminal of the wiring board are connected to the metal junction via the noble metal bump. Melting | fusing point of the metal material which comprises a metal junction part is 275 degreeC or more, and contains resin (underfill) which contains 50 vol% or more of inorganic fillers between a chip and a board | substrate. |