http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20020036117-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_124647a3258788bf0811fe7e3d136fba |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0048 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0236 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate | 2000-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b76ea41e297ecc4b7c55f20fcc27f207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3a3c0a433b40c89620002f87103f686 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8e51edae0fc9fc5128d436d4b799633a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1183de4b1491f0f210a9053072d0cbcb |
| publicationDate | 2002-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20020036117-A |
| titleOfInvention | A composition for protection film having acid resistance |
| abstract | BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photosensitive protective film composition for protecting a microcircuit pattern from an acid in a process of cleaning a back surface of a wafer with an acid cleaning solution during a semiconductor device manufacturing process. A photosensitive protective film resin composition comprising a compound and an organic solvent, wherein the polymer resin is composed of a novolak resin and an acrylic resin, the photosensitive compound is a diazide compound, and the organic solvent is ethyl lactate and 1-methoxy-2. -A mixture of propanols.n n n The photosensitive protective film composition of the present invention not only has excellent wafer protection ability against acid but also does not cause residue defects even after the development process and includes a photosensitive component, so that an additional protective film coating and removal process is not required, thereby maximizing productivity. There is an advantage that can minimize the defective rate. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021094423-A1 |
| priorityDate | 2000-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.