| abstract |
The organometallic copper complexes of the following formulas may be used for the production of copper metal films by chemical vapor deposition:n n n n n n n n n n [Wherein R 1 and R 2 are each alkyl or perfluoroalkyl; R 3 is hydrogen, fluorine, or perfluoroalkyl; At least one of R 4 -R 7 has a group of formulan n n n n n n n n n (Wherein R a is alkylene, R b , R c and R d are each alkyl group and M is oxygen or sulfur);n n n The others are hydrogen or alkyl, respectively. |