abstract |
The present invention makes it possible to form a buried wiring made of a healthy conductive material without defects even in a recess having a high aspect ratio. In the present invention, when the conductive metal 20 is embedded by wet plating in the fine concave portion 14 provided on the surface of the substrate W, the base film 18 composed of two or more metals on the surface of the substrate is formed. ), And wet plating is performed on the surface of the base film 18. |