http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20020034956-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76865
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76874
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3205
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
filingDate 2001-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d181780dc7866eed0a2176e00c99ac46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cdb0a88a781c044a0afebd6dcb38ffc5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d48e7869bb6a46df1977c761d40ed37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_baf129d85fbb84e5ccfc739d69cf5c41
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_968677a28d2d745fb2bb781f663b1140
publicationDate 2002-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20020034956-A
titleOfInvention Method of forming wiring and semiconductor device
abstract The present invention makes it possible to form a buried wiring made of a healthy conductive material without defects even in a recess having a high aspect ratio. In the present invention, when the conductive metal 20 is embedded by wet plating in the fine concave portion 14 provided on the surface of the substrate W, the base film 18 composed of two or more metals on the surface of the substrate is formed. ), And wet plating is performed on the surface of the base film 18.
priorityDate 2000-11-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23939
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419557109
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23954
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID458431511
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419558592
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23938
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978

Total number of triples: 33.