http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20020030242-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c535650b049cf935240497035cc37778 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0483 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06727 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07314 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-0466 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06738 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-00 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate | 2000-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7eb8328e17cee877457cdddb7d0a2e5 |
| publicationDate | 2002-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20020030242-A |
| titleOfInvention | Connector apparatus |
| abstract | A mechanically flexible connector is disclosed that provides reliable electrical connection with contact pads on microelectronic devices. The connector can be used for burn-in of integrated circuits at the wafer level. It can also be used for probe cards and flip chip sockets to test integrated circuits for other applications. The configuration of the connector includes a probe with a tip 81 protruding over the extended spring 83 of the membrane. The thin film spring is supported over the substrate 89 by the posts 85 to allow the probe tip to move freely in the vertical direction by the contact force acting on the probe tip. The bending of the probe tip is flexibly limited by bending and unfolding of the thin film spring. The mechanical flexibility of the tip allows the pads of the integrated circuit and the probe array to contact where the pads are not strictly planar. |
| priorityDate | 2000-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.