| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 |
| filingDate |
2001-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_afd80f3c1c3a775f217afbd2dcd30661
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d245d2827b04587ed998ef15c87adf2b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a61deda83a2e47fac302602e07af3de1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1d4b3c6bf6c0c94ac398133519ef9a05 |
| publicationDate |
2002-01-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20020002332-A |
| titleOfInvention |
Copper-plating liquid, plating method and plating apparatus |
| abstract |
The present invention, when used in the plating of a substrate having an outer seed layer and a fine recess with a high aspect ratio, can reinforce a thin portion of the seed layer and can completely fill copper to the depth of the fine recess and A copper plating solution free of cyanide is provided.n n n The plating liquid contains divalent copper ions, a complexing agent and an optional pH adjusting agent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101585200-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120030399-A |
| priorityDate |
2000-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |