abstract |
The present invention provides a thermoplastic or thermosetting adhesive for bonding an electronic component to a substrate, comprising at least one multifunctional or monofunctional maleimide compound, or at least one polyfunctional or monofunctional vinyl compound which is not a maleimide compound, or maleimide An adhesive is provided that cures in situ from a curable composition comprising a combination of vinyl compounds, a curing initiator, and optionally one or more fillers. |