| abstract |
The photocurable resin composition of the present invention comprises at least a part of an organosilicon compound, an epoxy resin, and a photoinitiator that absorbs activating light to polymerize an organosilicon compound or an epoxy resin, and is polymerized and cured by absorption of activating light. The hardened | cured material maintains the elasticity modulus at the high temperature of Tg or more, the difference in the room temperature and high temperature of a thermal expansion coefficient is small, and since the adhesive force at high temperature does not fall, the multilayer wiring board and semiconductor which are hard to produce cracks and peelings well It is suitably used for the apparatus. |