| abstract |
Probe cards are provided for contacting electronic components with raised contact elements. In particular, the present invention is useful for contacting a semiconductor wafer with contact elements such as springs. The probe card is designed to have terminals for matching with contact elements on the wafer. In a preferred embodiment, the terminals are pillars. In a preferred embodiment, the terminals comprise a contact material suitable for repeated contact. In one particularly preferred embodiment, the spacer is provided with contact posts on one side and terminals on the opposite side. An interposer with spring contacts connects the contacts on the opposite side of the gap transducer to the corresponding terminals of the probe card, which in turn are connected to terminals connectable to test equipment, such as conventional testers. |