http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20010085962-A

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filingDate 2000-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2001-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20010085962-A
titleOfInvention Method for measuring leveler concentration of plating solution, and method and apparatus for controlling plating solution
abstract In the present invention, the leveler concentration in the plating liquid of the plating apparatus used to fill metals such as copper in the wiring grooves and holes formed on the surface of the semiconductor substrate or the like is measured in the peeling region of the plating liquid measured by the CV method or the CVS method. The peak value area (Ar value) is obtained.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100885369-B1
priorityDate 1999-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 26.