| abstract |
The present invention relates to a method and apparatus for dicing a semiconductor wafer. The processing of ultra-fine dicing streets is possible, there is no chipping, and the uniform precision of the dicing line is maintained throughout the wafer. In addition, a method and apparatus for dicing semiconductor wafers for semiconductor chip manufacturing, which are suitable for dicing ultra-thin wafers stably, improving yield in large-diameter wafers, and performing automatic cleaning not only for dicing itself but also after dicing. In providing. |