http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20010079864-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-688 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2000-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2001-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20010079864-A |
| titleOfInvention | Epoxy resin composition and semiconductor device |
| abstract | The present invention provides epoxy resin compositions having fast curing properties and good storage stability and useful in the electronic and electrical fields, and semiconductor devices obtained using such compositions. That is, the present invention provides a compound (A) having two or more epoxy groups in a molecule, a cocondensate (B) having two or more phenolic hydroxyl groups in a molecule, and a tetrasubstituted phosphonium (X), two or more in a molecule. Compound bases (Y) having phenolic hydroxyl groups, and compound bases (Y) having two or more phenolic hydroxyl groups in the molecule, which conjugate bases have the aforementioned compounds having two or more phenolic hydroxyl groups in the molecule It is an epoxy resin composition which consists of a molecular association (C) of (Y) the phenoxide type compound obtained by removing a hydrogen atom from (Y). |
| priorityDate | 1999-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 103.