| abstract |
An object of the present invention is to provide a substrate plating method and apparatus that can be wired by efficiently filling a fine concave portion 42 formed in a semiconductor substrate (W) with less voids or contamination and performing wiring, In a substrate plating method for filling a plating metal 43 in a wiring recess of a semiconductor substrate, an electroless plating step of forming an initial film 41 on a substrate W, and electrolysis using the initial film as a feed layer Plating was performed to perform an electrolytic plating process for filling the recesses. |