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filingDate 2000-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cc4b4b30c7a8db050bef0caab0fb43a9
publicationDate 2001-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20010070138-A
titleOfInvention An Improved Method To Embed Passive Components
abstract The present invention relates to a method for embedding thick film passive components in an organic substrate on which a conductive paste underprint is applied to a flexible metal substrate. The method includes applying a conductor paste underprint on a flexible metal substrate; Firing the article; C. applying one or more passive component pastes on the underprint; D. firing the article; E. applying a passive component side of the metal substrate to at least one side of the organic layer at least partially coated with the adhesive layer to embed the passive component side of the article in the adhesive layer.
priorityDate 1999-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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