http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20010065793-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a492183be65153abfa7dec00d51c816 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2033-0095 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30604 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01B5-28 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N33-00 |
| filingDate | 1999-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc5a963702330ae950272a4794d52f98 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f5d9253ec3573fc90f8ba0ce420c7dbd |
| publicationDate | 2001-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20010065793-A |
| titleOfInvention | Measuring method of eliminatability of organic contamination |
| abstract | The present invention relates to a method for measuring a chemical removal capability for removing organic contaminants on a silicon substrate in a manufacturing process of a semiconductor device, comprising: depositing an oxide film on a silicon substrate; Artificially adsorbing organic pollutants on the silicon substrate on which the oxide film is deposited; Washing each of the chemicals to be evaluated for removal of the adsorbed organic pollutants; Then etching the oxide film with an etching solution of hydrofluoric acid; And it provides a method for measuring the organic pollutant removal capacity of the chemical chemical composition comprising the step of measuring the roughness of the surface. By measuring the ability to remove organic contaminants by the method according to the present invention, by selecting the optimal cleaning solution to improve the cleaning ability of the contact hole that the organic material is adsorbed well by capillary action and the ability to remove particles appearing after CMP treatment As a result, the overall cleaning capability of the process can be improved, thereby improving the reliability and yield of the device. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100848247-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014105765-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8932874-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104903996-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104903996-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9677998-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100797228-B1 |
| priorityDate | 1999-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.