| abstract |
The present inventionn n n (1) 2-10% by weight of an epoxy resin preparation in which an oxo cresol epoxy resin is pretreated with a silane coupling agent having a mercapto group,n n n (2) 1-8% by weight of diglycidyl hexamethyl biphenyl epoxy resin,n n n (3) 0.8-1.2 wt% bromine epoxy flame retardant and antimony trioxide mixture,n n n (4) 3-7.5 weight% of hardeners,n n n (5) 0.05-0.40 weight% of hardening accelerators,n n n (6) 77-87 weight% of inorganic fillers,n n n (7) 0.1-0.2% by weight of waxn n n The present invention relates to an epoxy resin composition comprising a, and may be usefully used as a package for sealing a semiconductor element. |