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filingDate 2000-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8324c5047b97adfaf39dbea9979660d
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publicationDate 2001-07-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20010061982-A
titleOfInvention Copper powder and process for producing copper powder
abstract When forming the external electrode of a laminated ceramic capacitor by sintering of copper powder, this invention obtains the copper powder which can obtain the integral baking goods without an air gap even if the sintering temperature is low.n n n The average particle diameter is in the range of 0.1 micrometer or more and less than 1.5 micrometers, and the particle | grains whose width | variety whose particle | grains which A value which follows the following formula (1) below 1.2 (X25) defined below below express 1.2 are 1.2 or less Copper powder, which is a molten sintered plastic product when it maintains at 800 degreeC temperature in 1 atmosphere of inert gas atmospheres.n n n A value = (X75-X25) / X50 (1)n n n However, X25, X50, and X75 are cumulative particles having a particle diameter X (µm) on the horizontal axis and a Q% (the proportion of particles having a particle diameter equal to or less than X corresponding to X; the unit is volume% of the particle) on the vertical axis. In the Fig. Curve, the values of the respective particle diameters X correspond to Q% = 25%, 50% and 75%. The copper powder can be obtained by performing in the presence of ammonia or an ammonium group when wet reduction from cuprous oxide to metal copper powder.
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