http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20010053454-A
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-264 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-425 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-426 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 |
| filingDate | 1999-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2001-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20010053454-A |
| titleOfInvention | Composition for stripping photoresist and organic materials from substrate surfaces |
| abstract | TECHNICAL FIELD The present invention relates to the field of microelectronics, such as integrated circuits, and more particularly, to methods and compositions for removing photoresists or other organic materials from the surface of substrates used in the manufacture of integrated circuits. In particular, the present invention relates to an amine-free stripping composition comprising a surfactant and a solvent, which can effectively remove the organic material without corroding the substrate below. It is related to a method of removal using a stripping composition. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20020072595-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190076904-A |
| priorityDate | 1998-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 91.