| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76873
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-20 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-288
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25F3-14 |
| filingDate |
2000-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e064bb1e5eed204cf419adedf73ec576
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c64b3ea34549fe09e64bf7bab53da5b |
| publicationDate |
2001-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20010051801-A |
| titleOfInvention |
Hardware design, system configuration and process sequence for improved seed layer productivity and achieving 3mm edge exclusion for a copper metalization process on semiconductor wafer |
| abstract |
The present invention generally provides an apparatus and method for electrochemically depositing a metal layer on a substrate to have high productivity and minimal edge exclusion. The present invention includes depositing a full coverage seed layer over a substrate; Electrochemically depositing a metal layer over the seed layer; And removing the seed layer exposed from the annular edge portion of the substrate. The invention also provides an electrochemical deposition cell having a cathode contact member adapted to contact the periphery of the substrate within about 3 mm from the substrate edge, and a process cell adapted to remove the seed layer exposed on the periphery of the substrate; And a transfer chamber having a robot adapted to transfer the substrate between the electrochemical deposition cell and the process cell for removing the exposed seed layer. |
| priorityDate |
1999-11-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |