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filingDate 2000-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_910cc16fa105e19192378d2eaef5ccac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c22ab6955d39c2051c82aaedb88ca2dc
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publicationDate 2001-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20010051067-A
titleOfInvention Room Temperature Curable Organopolysiloxane Compositions
abstract The present invention (A) 100 parts by weight of the organopolysiloxane represented by the formula (1),n n n (B) has at least one or more monovalent organic groups having an aliphatic cyclic hydrocarbon group or aromatic hydrocarbon group which may have an unsaturated bond, bonded to a silicon atom in one molecule, and at least two ketoxime groups bonded to a silicon atom in one molecule 0.1 to 20 parts by weight of an organosilicon compound having at leastn n n (C) 1 to 500 parts by weight of inorganic fillern n n It relates to a room temperature curable organopolysiloxane composition characterized in that it contains.n n n n n n n n n n Wherein R 1 is selected from a ketoxime group, a methoxy group, a propenoxy group and a 2-methoxypropylene glycol group, R 2 , R 3 are a substituted or unsubstituted monovalent hydrocarbon group, and p is 2 or 3 M is an integer of 10 to 1 million centistokes (cst) of the organopolysiloxane at 25 ° C.n n n The room temperature curable organopolysiloxane composition of the present invention has excellent storage stability, and provides a cured product having excellent adhesion to adherends, especially surface-treated aluminum materials, and excellent water immersion and heat resistance adhesives, coating materials, electrical insulation. It can be used suitably as a sealing material, a building sealing material, etc., and it is especially suitable for a working joint.
priorityDate 1999-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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