| abstract |
The present inventionn n n (A) epoxy resin,n n n (B) curing agent,n n n (C) inorganic fillers,n n n (D) A microcapsule catalyst containing an imidazole compound and / or an organophosphorus compound, having an average particle diameter of 0.5 to 50 µm and a catalyst elution amount from the microcapsules in o-cresol at 30 ° C. for 15 minutes. The present invention relates to an epoxy resin composition comprising a microcapsule catalyst which is 70% by weight or more of the total amount of the catalyst contained therein.n n n The epoxy resin composition for semiconductor encapsulation of the present invention has good curability, high potential, and good shelf life. |