| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0073 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-34 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| filingDate |
1999-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2001-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20010041221-A |
| titleOfInvention |
Resist stripping process |
| abstract |
The present invention is directed to a method of removing patterned resist from a substrate surface in manufacturing a printed wiring substrate. The method includes contacting the patterned resist with a stripping solution containing an alkali source and ammonium ions. The stripping solution is characterized in that it does not contain a volatile organic compound (VOC). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20030007288-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100582202-B1 |
| priorityDate |
1998-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |