http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20010040066-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate | 2000-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d5e9102a099ce79ed6ad0077b47a6456 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3101e8b0e063d2f58982d3ecd9964b9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3611205ca0d7b85094d8707f585d0bed http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2726ad1bb1ef8fd6568e3bb4ae1b627 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1a9dc4e459bbd8b96ff73dfe1196e1f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_569699f84064dd94ecd7b51bbf079f0d |
| publicationDate | 2001-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20010040066-A |
| titleOfInvention | Method and composite arrangement inhibiting corrosion of a metal layer following chemical mechanical polishing |
| abstract | The high efficiency CMP of the present invention is achieved as a corrosion resistant metal layer by a multistep polishing technique. One embodiment of the present invention includes the steps of: forming a copper containing layer on a substrate; Polishing the copper containing layer to substantially planarize and expose the surface of the layer; Buffing the substrate having the substantially planarized and exposed copper containing layer with a buffing pad; Rinsing the substrate buffed with a solvent comprising about 1 weight percent benzotriazole in deionized water during or after the buffing step to form a corrosion inhibiting layer of benzotriazole in the copper containing layer; And separating the substrate from the buffing pad without using the actual pressure between the substrate and the buffing pad to keep the benzotriazole layer substantially intact and to prevent corrosion of the copper containing layer. |
| priorityDate | 1999-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.