| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_86dc9c9f208867a10f82d3b99e58a4b6 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-60 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58 |
| filingDate |
2000-10-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ee460979dcef0182a5b057ff27f20a9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_288856385f24ecd9e8632791e95af41b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a140123bfc68c5f4e17b99b36ab0bc4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_191be582506035ce13da0f0c66da6015 |
| publicationDate |
2001-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20010039969-A |
| titleOfInvention |
Sn-Cu ALLOY PLATING BATH |
| abstract |
The present invention provides an acid Sn-Cu alloy plating bath which can prevent substitution precipitation of Cu 2+ and clouding of SnO 2 without using a complexing agent. The following components (a) to (c)n n n (a) Sn 2+ ions and Cu 2+ ions,n n n (b) at least one acid selected from alkanesulfonic acid, alkanolsulfonic acid and sulfuric acid, andn n n (c) thiourea compoundsn n n Provided is a Sn-Cu alloy plating method for cathodic electrolysis of an acidic Sn-Cu alloy plating bath containing a metal and a plated object in the acidic Sn-Cu alloy plating bath. |
| priorityDate |
1999-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |