| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-24 |
| filingDate |
1999-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91d44f6ac2ade4ee0cdc067bd4195e74
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2ec68e0915d8c111e5cf13d91f37bfa9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_79d76beae5405474a21b3da1d7f3cca7 |
| publicationDate |
2001-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20010036682-A |
| titleOfInvention |
Method for forming a metal layer using electroplating |
| abstract |
A metal film forming method using an electroplating method is disclosed. This includes loading a semiconductor substrate into a chamber to be electroplated, applying a current to both electrodes of the chamber, dipping the semiconductor substrate into an electrolyte, and depositing a metal film, and stopping the current applied to both electrodes of the chamber. It comprises a step. |
| priorityDate |
1999-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |