| abstract |
The present invention relates to epoxy compounds having two or more epoxy groups per molecule, optional thiol compounds having two or more thiol groups per molecule, latent curing agents, and those having at least one solid organic acid that is substantially insoluble in the mixture of the aforementioned components at room temperature. And curable epoxy-based compositions for use in the field of microelectronics. Solid organic acids consist of aliphatic, cycloaliphatic and aromatic carboxylic acids and their derivatives, aliphatic, cycloaliphatic and aromatic quinones and their derivatives, phenols and their derivatives and enolable aliphatic, cycloaliphatic and aromatic compounds and their derivatives Can be selected from. The solid organic acid should have a pKa less than or equal to about 12.0, preferably less than or equal to about 10, and usually less than or equal to 7.5, less than or equal to 9.0. The present invention also relates to a curable epoxy-based composition comprising said epoxy compound, thixotropy-imparting component, latent curing agent and at least one solid organic acid, which demonstrate improved flow properties such as yield point retention and viscosity retention over time. will be. |