| abstract |
On the semiconductor chip 12 provided with the plurality of electrode pads 14, an insulating film 16 is formed on each electrode pad 14 by forming an opening 16a, and through each opening 16a, each electrode pad is formed. A plurality of lower electrodes 19 which are electrically connected to the 14 are provided on the insulating film 16, and protrude from the sidewall surfaces 12b and 12c of the semiconductor chip 12 on the lower electrodes 19, respectively. A plurality of projection electrodes 22 are provided to constitute the semiconductor device 1. The semiconductor chip 12 sidewall surface is opposed to the circuit board, and the semiconductor device 1 is provided on the circuit board, and the protruding electrode 22 is connected to the electrode on the board, thereby reducing the connection area and miniaturizing the electronic device. Make it possible. |