http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20010032974-A
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-04 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-02 |
filingDate | 1998-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2001-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-20010032974-A |
titleOfInvention | Test system with mechanical alignment for semiconductor chip scale packages and dice |
abstract | A test system 28 is provided for testing semiconductor components 30A, such as bumped dice 10 and chip-scale packages 14. The test system 28 includes a base 32 for holding one or more components 32A, and an interconnect 36 for making temporary electrical connections with the component 30A. The test system 28 also includes an alignment mechanism 48 having an alignment surface for aligning the component 30A with respect to the interconnect 36. And an alignment member such as an inclined edge 72A, bump 72B, or post 72C formed to interact with the alignment surface. The alignment mechanism 48 is formed as a polymer layer 48A, such as a resist layer, which is deposited, deposited and then cured using a wafer level fabrication process. The alignment surface is provided with an opening 50A in the polymer layer 48A formed to engage the edge of component 30A or to engage the alignment member. |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101388790-B1 |
priorityDate | 1997-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 19.