| abstract |
The described deposition systems are designed to provide new precursors and chemical processes used in transport polymerization and chemical vapor deposition. The system of the present invention mainly consists of a reactor, a liquid injector or a flow regulator of a gas mass, a cracker, and a vacuum deposition chamber. Crackers use one or more types of energy, including heat, photons, and plasma. The present invention relates to the use of F-PPX (fluorinated poly (para-xylylene)) for intermetal dielectric (IMD) applications and interlevel dielectric (ILD) And is particularly useful for producing fluorinated polymer thin films. |