| abstract |
The present invention relates to a chip scale ball grid array for integrated circuit packaging having a non-polymeric layer or support structure positioned between a semiconductor die and a substrate. Non-polymeric support structures serve to increase circuit reliability by reducing thermal strain effects and / or reducing or eliminating the formation of voids in integrated circuit packages. The non-polymeric support structure may be a material with sufficient strength to allow processing of the chip scale package in strip format, such as copper foil. |