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filingDate 1999-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec72e12d4077c325ad02dc88ccb08bb3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ebbd60ff072e3745685e70c703ebf98
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publicationDate 2001-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20010019927-A
titleOfInvention Additives for improving post exposure delay stability of photoresist
abstract The present invention relates to a compound that can be used as an additive to ensure the post exposure delay stability of the photoresist and a photoresist composition comprising the same, in the present invention has a suitable level of basic urea of formula (1) (urea) compounds are introduced as additives to reduce the effects of amines present in the external atmosphere, thereby reducing the effects of KrF (248 nm), ArF (193 nm), electron beams (E-beams), ion beams, and EUV (extremely ultra violet). In the lithography process using a light source such as), it is possible to effectively prevent the pattern from being formed or the T-top from being formed by the post-exposure delay, which is a problem of the alicyclic compound used as the photoresist.n n n [Formula 1]n n n n n n n n Wheren n n A, R, R 1 to R 7 are as defined in the specification.
priorityDate 1999-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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