| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-2414 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-2414
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06744 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R13-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R4-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-073 |
| filingDate |
2000-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2001-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20010006931-A |
| titleOfInvention |
Packaging and interconnection of contact structure |
| abstract |
The packaging and interconnects are conductive structures of a conductive material formed on the contact substrate through a micro manufacturing process, contact pads provided on the bottom surface of the contact substrate and connected to the contact substrates, and contact pads provided on the printed circuit board (PCB) PCB pads electrically connected with, a conductive member for connecting the contact pads and the PCB pads, an elastomer provided under the contact substrate for packaging of the contact structure and flexibility of the interconnect, and contact structures, contact pads And a support structure provided between the elastomer and the PCB to support the elastomer. |
| priorityDate |
1999-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |