| abstract |
An uncured heat-resistant resin matrix which aims to provide an electroless plating adhesive and a printed wiring board, which are advantageous for maintaining the practical film strength and securing insulation reliability between solder layers, and which are hardly soluble to acids or oxidants by curing. An electroless plating adhesive obtained by dispersing soluble hardened heat resistant resin particles in an acid or an oxidizing agent, wherein the heat resistant resin particles have an average particle diameter of 1.5 μm or less, and the adhesive It provides a printed wiring board using. |