| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a492183be65153abfa7dec00d51c816 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N5-0619
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N5-067 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
1999-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f96cfc92657bc7b73216d37b45b8cee7 |
| publicationDate |
2001-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20010002843-A |
| titleOfInvention |
mole type wafer level package |
| abstract |
The present invention discloses a moldable wafer level package. In the disclosed invention, a lower insulating layer is applied to expose a bonding pad to a surface of a semiconductor chip. A metal pattern, one end of which is connected to the bonding pad, is deposited on the lower insulating layer. An upper insulating layer is applied on the lower insulating layer so that the other end of the metal pattern is exposed. A solder ball for connection is mounted on the other end of the exposed metal pattern. An elastic pad layer is applied over the top insulating layer to expose the connecting solder balls. A joint auxiliary layer is formed on the exposed solder balls for the connection. The entire result is molded with encapsulant so that only the bonding auxiliary layer is exposed. Mounting solder balls are mounted on the exposed bonding auxiliary layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101278938-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160009691-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101484494-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100830348-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100988403-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7808095-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100909322-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7569423-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200029519-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11145794-B2 |
| priorityDate |
1999-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |