| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-935
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-926
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S428-929
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12993
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-12944 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49579 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate |
1998-01-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2000-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20000068907-A |
| titleOfInvention |
Lead frame material |
| abstract |
The phosphorus content of 1.6-10 micrometers in thickness forms the nickel phosphorus alloy layer (B) of 0.3-1.0 weight% on copper or copper alloy layer (A) of thickness 35-300 micrometers, and this nickel phosphorus alloy layer The lead frame material formed by forming the copper layer C of thickness 0.2-30 micrometers again on (B) as needed does not require a complicated process, such as vapor deposition. The etching stop layer can be formed by plating, and the heat resistance is excellent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20000007350-A |
| priorityDate |
1997-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |