| abstract |
Lead frames for use in integrated circuit chips include a lead frame base made of aluminum or an aluminum alloy with a zinc surface layer, a first nickel layer on the zinc layer laminated to combine aluminum and zinc, nickel on the first nickel layer Soldering to the lead frame, wire bonds, and other components, including an alloy layer of precious metals, a second nickel layer on the alloy layer laminated to suit bending and soldering of the leads, and an outermost precious metal layer. Suitable for |