http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20000062733-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-00
filingDate 2000-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2000-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20000062733-A
titleOfInvention Plasma etching of silicon using fluorinated gas mixtures
abstract The method of etching silicon using a plasma generated from a gas comprising fluorine (F), oxygen (O), hydrogen (H) and carbon (C) comprises supplying the gas to a chamber, and Igniting the plasma, and etching the silicon material layer in the chamber, thereby increasing the mask selectivity while increasing the silicon etch rate.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100973305-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210034719-A
priorityDate 1999-03-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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