patent/KR-20000057332-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20000057332-A

Outgoing Links

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classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-498 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
filingDate	1997-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_457d6e7d551e57d02b45b0d27a8751ac http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d3fa1ff9dfe3f1cbd6963df746fd744
publicationDate	2000-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20000057332-A
titleOfInvention	Chip scale ball grid array for integrated circuit package
abstract	A chip scale ball grid array for an integrated circuit package has a nonpolymer layer 50 or support positioned between the semiconductor die 52 and the substrate 76. Nonpolymer supports serve to increase circuit reliability by reducing thermal stress effects and / or reducing or eliminating gap formation in integrated circuit packages. The nonpolymer support may be a material, such as a copper foil, that is hard enough that the chip scale package process can be in strip form.
priorityDate	1996-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341

Total number of triples: 66.