http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20000053544-A

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filingDate 2000-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cfb44ea7ae7f3b5e71f7665f7affe71f
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publicationDate 2000-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20000053544-A
titleOfInvention An integrated circuit device having an internal top to bottom conductive path
abstract The present invention has an integrated circuit including an element substrate having a top surface and a bottom surface, the device substrate comprising an electrically conductive via, the electrically conductive via being formed from the bottom surface to the top surface of the device substrate. And the wall of the electrically conductive via is separated from the element substrate by an electrical insulator.
priorityDate 1999-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 29.