Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f481982f9992cbb527a6d31589832958 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-77 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-77 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
2000-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cfb44ea7ae7f3b5e71f7665f7affe71f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfd5367ed6a4fb8387292865f992bfba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9871d0575bce30332ca5d96c41c32082 |
publicationDate |
2000-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20000053544-A |
titleOfInvention |
An integrated circuit device having an internal top to bottom conductive path |
abstract |
The present invention has an integrated circuit including an element substrate having a top surface and a bottom surface, the device substrate comprising an electrically conductive via, the electrically conductive via being formed from the bottom surface to the top surface of the device substrate. And the wall of the electrically conductive via is separated from the element substrate by an electrical insulator. |
priorityDate |
1999-01-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |