http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20000047769-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_89afae566b725ae78e20cf972d9bcdc7 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2026 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-32 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-5022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-168 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-32 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate | 1999-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b9bd142784285954564fbd5330cba6d4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ff9f5f34b315fa455ae8f12523b011d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7061c4c60aded3bce4671cc01549de7e |
| publicationDate | 2000-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-20000047769-A |
| titleOfInvention | Method for manufacturing Substrate for electronic parts and Resist remover nsed to the same |
| abstract | BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component base material and a resist remover used therein, wherein the photoresist film is patterned and exposed to an unnecessary photoresist film having high safety and that does not require patterning adhered to the periphery, margin, and back of the substrate. Prior to this, the object of the present invention is to provide a photoresist remover that satisfies the required performance for dissolving and to provide a method for producing an electronic component base material having excellent performance by using the same. A coating liquid for forming a radiation-sensitive resist film was applied to the film, dried to form a photoresist film, and thereafter, an unnecessary photoresist film attached to the periphery, the edge portion, and the back of the substrate was dissolved and removed using a photoresist removing agent. In manufacturing, the surface at 20 ℃ as the photoresist removing agent Use of an organic solvent exhibiting solubility in a radiation-sensitive resist film, for example, a mixed solvent having a specific ratio of? -Butyrolactone and anisole, in the range of the tension greater than 35 dyne / cm and smaller than 60 dyne / cm. It is a feature. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170132805-A |
| priorityDate | 1998-12-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 66.