abstract |
The present invention relates to a resin composition composed of a copolymer of styrene and maleic anhydride (SMA), an epoxy resin and a heterocrosslinking agent as a crosslinking agent.n n n The heterocrosslinker is optionally brominated bisphenol A (BPA), or optionally brominated bisphenol A diglycidyl ether (BPADGE), or a mixture thereof, the composition is an allyl network forming compound, and the resin composition is a laminate and a printed wiring board. Characterized in that it is used to manufacture. |