Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b73bb5b611ad02b686a7967bc6ca3412 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-001 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-245 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24 |
filingDate |
1997-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffbb976b98011b12b9ab08275cc64363 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9eff17a51c46d232ff9eb10523198cf6 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2d71647fed8abf02fadcbfca893506f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1731c19452da280a2ac18384810c217 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b83d5eb6d90a42869e5f9dc8063a3f8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cee07c2fe6fe5de1f014f8126532bfc1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b292822e9d3d21039c0f79e705088c2 |
publicationDate |
2000-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
KR-20000029865-A |
titleOfInvention |
Abrasive construction for semiconductor wafer modification |
abstract |
Disclosed is a polishing structure for modifying the surface of a workpiece such as a semiconductor wafer. The abrasive structure comprises a three dimensional textured stationary abrasive element; At least one resilient element overlying the same space as the fixed abrasive element; And at least one rigid element that is generally coplanar with and interposed therebetween with the resilient element and the fixed abrasive element, wherein the rigid element has a Young's modulus greater than the resilient element. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101159160-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170005011-A |
priorityDate |
1996-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |