http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20000029865-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b73bb5b611ad02b686a7967bc6ca3412
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-245
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D11-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-24
filingDate 1997-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffbb976b98011b12b9ab08275cc64363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9eff17a51c46d232ff9eb10523198cf6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f2d71647fed8abf02fadcbfca893506f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1731c19452da280a2ac18384810c217
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b83d5eb6d90a42869e5f9dc8063a3f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cee07c2fe6fe5de1f014f8126532bfc1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b292822e9d3d21039c0f79e705088c2
publicationDate 2000-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20000029865-A
titleOfInvention Abrasive construction for semiconductor wafer modification
abstract Disclosed is a polishing structure for modifying the surface of a workpiece such as a semiconductor wafer. The abrasive structure comprises a three dimensional textured stationary abrasive element; At least one resilient element overlying the same space as the fixed abrasive element; And at least one rigid element that is generally coplanar with and interposed therebetween with the resilient element and the fixed abrasive element, wherein the rigid element has a Young's modulus greater than the resilient element.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101159160-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170005011-A
priorityDate 1996-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID25644
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415713226
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID57340108
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID407658261
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID16734986
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID415860858
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID413130148
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID423579653
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID50918837
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID166480
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID74172
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449616204

Total number of triples: 42.