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filingDate 1999-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bec9031082feee2e176aa1575fc6e578
publicationDate 2000-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-20000029078-A
titleOfInvention Resin composition for overcoat of flexible circuit
abstract An object of the present invention is to provide an overcoating agent which is hard to occur such as hardening of a coating film or an increase in warping even when it is left at a high temperature for a long time.n n n In order to solve the above problems, a resin hydrogenated to a double bond portion in a polybutadiene skeleton, specifically, a hydrogenated poly having a number average molecular weight of 1,000 to 8,000 and 2 to 10 hydroxyl groups per molecule Butadiene polyol (A) and hydrogenated polybutadiene polyblock isocyanate (Xa) having a number average molecular weight of 1,000 to 8,000 and having 2 to 10 block isocyanate groups per molecule, and the amount of polyblock isocyanate is the total The said subject is solved by using the resin composition for flexible circuit overcoating etc. which become 0.8-3.5 times equivalent number with respect to a siloxane group equivalent number.
priorityDate 1998-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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